SiC Processing AG
SiC Processing AG: Determination of issue price and share allocation delayed
Ad hoc announcement transmitted by DGAP – a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.
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Determination of issue price and share allocation delayed
SiC Processing AG has not yet determined the issue price nor has it taken a
decision on the allocation of shares in conjunction with the selling
shareholder, Garbo Servizi S.r.l., and the Global Coordinator, Bayerische
Hypo- und Vereinsbank AG. In view of the low demand from retail investors,
SiC Processing AG currently anticipates that retail investors will not be
allocated any shares.
SiC Processing AG expects the decisions on the issue price and the
allocation of shares to be taken in the course of November 29, 2006. As a
consequence start of trading of the shares is expected on November 30,
2006.
The Management Board
Hirschau, November 29, 2006
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Information and Explaination of the Issuer to this News:
This publication constitutes neither an offer to see nor an invitation to
buy or to subscribe securities. The offer will be made exclusively by means
of and on the basis of the securities prospectus published and deposited at
the Federal Agency for the Supervision of Financial Services (Bundesanstalt
für Finanzdienstleistungsaufsicht, BaFin). The Securities Prospectus is
available free of charge with the issuer and with the issuing bank and on
the internet under www.sic-processing.com.
This information is not meant to be published and must not be published in
the United States of America. This publication does not constitute an offer
to sell securities in the United States of America. The securities
mentioned in this publication are not and will not be registered pursuant
to provisions of the US Securities Act 1993 as amended and may only be sold
or offered for purchase upon registration or based on an exemption from the
requirement to register. The shares are not and will not be publicly
offered in the USA.
About SiC Processing AG:
SiC Processing AG offers its customers in the wafer industry a
comprehensive range of services for the processing of sawing slurries used
in the production of wafers for the photovoltaics and semiconductor
industries. Based in Hirschau, Germany, the technology company has four
locations worldwide. In addition to the recovery and processing service
proper, SiC Processing AG offers its customers comprehensive and customised
logistics services. On a pro-forma basis, i.e. including the activities in
Italy, Norway and the USA, which were integrated into the SiC Group only in
2006, 2005 sales totalled approx. EUR 19.0 million. Pro-forma EBIT for the
year 2005 amounted to EUR 2.2 million. In the first nine months of 2006,
sales and earnings of SiC Processing continued to grow at double-digit
rates. The SiC Group almost doubled its production capacities in 2005 and
2006. At the end of 2006, the Group is expected to have installed a
production capacity of up to 65,500 t of sawing slurry per year.
(c)DGAP 29.11.2006
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Language: English
Issuer: SiC Processing AG
Dienhof 26
92242 Hirschau Deutschland
Phone: +49 (0)9622/7039-400
Fax: +49 (0)9622/7039-325
E-mail: info@sic-processing.com
WWW: www.sic-processing.com
ISIN: DE000A0LBF86
WKN: A0LBF8
Indices:
Listed: Amtlicher Markt in Frankfurt (Prime Standard); Freiverkehr in
Berlin-Bremen, Düsseldorf, München, Stuttgart
End of News DGAP News-Service
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